Infineon: Infineon Technologies AG today officially opened its high-tech chip factory for power electronics on 300-millimeter thin wafers at its Villach site in Austria under the motto “Ready for Mission Future.” At euro 1.6 bn, the investment made by the semiconductor group represents one of the largest such projects in the microelectronics sector in Europe. The Villach site is one of the world’s most modern fabs. The company set the stage for long-term, profitable growth based on energy efficiency and CO2 reduction at an early stage and announced the construction of the chip factory for power electronics (“energy-saving chips”) in 2018. “The new fab is a milestone for Infineon, and its opening is very good news for our customers,” Ploss said. “The timing to create new capacity in Europe could not be better, given the growing global demand for power semiconductors. The last few months have clearly shown how essential microelectronics are in virtually every area of life. Given the accelerated pace of digitalization and electrification, we expect demand for power semiconductors to continue to grow in the coming years. The additional capacities will help us serve our customers worldwide even better, including long term.”
Infineon: weekly performance:
Strabag: Construction group Strabags subsidiary Züblin has been commissioned to complete a new shipbuilding facility with integrated seven-storey office building in Kiel. Ed. Züblin AG is erecting the new skyline-defining industrial facility at Kieler Förde on behalf of thyssenkrupp Marine Systems GmbH. The contract value is in the high double-digit million-euro range. The foundation stone for the combined submarine production facility and administration building was laid in a ceremony at Kiel harbour on 17 September. Following the start of construction in May of this year, the new building is scheduled to be completed within around two years and handed over ready for use at the end of June 2023. With the new company headquarters at Kieler Förde, ThyssenKrupp Marine Systems intends to significantly expand its production capacities in submarine construction from mid-2023. The facility is part of a site concept that envisages the implementation of further construction projects at the Kiel shipyard site.
Strabag: weekly performance:
AT&S: IC substrate and printed circuit board manufacturer AT&S uses pure air as an innovative carrier medium for minimal signal loss in 5G applications. For this innovative transmission technology, the Styrian company received the Futurezone Award 2021 in the “5G Innovation of the Year powered by Huawei” category. "We have dealt intensively with new materials, manufacturing processes, and design features for innovative interconnection solutions and found a way to specifically place air chambers in the circuit board and reduce dielectric loss to an absolute minimum," says Hannes Voraberger, Director R&D at the Styrian high-tech group AT&S. After all, the slightest delay - in the case of self-driving cars, for example - could already have fatal consequences. This is exactly where the award-winning innovation from AT&S comes in.
AT&S: weekly performance:
(From the 21st Austria weekly https://www.boerse-social.com/21staustria (17/09/2021)
Marinomed stellt sich vor: Das Bild zeigt v.li. Pascal Schmidt (CFO, war u.a. auch beim Infineon-IPO dabei), Erste Group-Vorstand Peter Bosek für das Emissionshaus, CEO Andreas Grassauer und CSO Eva Prieschl-Grassauer.
Aktien auf dem Radar:Strabag.
Aktien auf dem Radar:Strabag.